This is the 3D from a 4 module motherboard. I originally planned to use standad 90mm wide boxes, meaning that the motherboard probably needed to be 86 – 88mm wide, but this draft is 91mm wide. It means I will have issues using standard 90mm low cost wide boxes, but 2,5 mm is a lot…
Using a PLC module (or any component) in BSA is straight forward – you simply declare an UML State symbol with the input/output events you need and set this as external with the selected interface protocol and addressing scheme. The protocol can be anything because BSA is after all just a visual specification, so the…
I will be using a few MCU’s to create PLC Modules, so it makes sence to create a template – starting project for each MCU. The most obvious is STM32G491RE. This template contains MCU, CAN, RS485, Crystal, SWD, Leds, FRAM and PSU condenced as tight as possible towards one side. The template might change, but…
DRV8313 is an excellent driver circuit containing 3 separate half h-bridges that can be used as separate PWM drivers, a DC Motor driver or 3-phase motor driver. Delivering 3.5A max in peak and supporting upt to 60V it is excellent for 12V, 24V or 48V systems. I have made a small motor driver on this…
Before I order any of the PCB’s I also need to consider adjusting the size of the modules. I have ordered several standard project boxes that I will consider using, but I lack exact mechanical dimensions on them. And I have to figure out the mounting holes on the motherboard to the project boxes. The…
The next module I want to make is the motherboard(s). I want to start with a 2, 4 and 8 module Motherboard. An early demo of a 4-module board is shown above. In this case I have mounted 4 x Ethernet modules – an advanced system will usually have two Ethernets for redundancy, but you…
Fisished routing. One days work – first attempt on 4-layer design. I must admit KiCAD did most of the job. Components top without Ethetnet modul. Components bottom layer All layers. I decided to use Ground and Power as the middle layers. I don’t add ground layer on top or bottom since this will be hand-soldiered.…
This prototype have a Wiznet breakout on top and a USB-C on bottom in front. The Wiznet breakout cover the M2 screw holes, so mouting these will be a little tricky, but doable. I will consider pushing the breakout a bit in-I need to alig RJ45 and USB-C infront anyway and that will help.
I have finished schematics, footprints, 3D models and placed the components and this starts to look good. The pictures below are exported directly from KiCAD. The Top layer contains the Ethernet module, MCU, crystals, leds and SWD. Only the 16Mhz crystal and some caps are under the Ethernet module. The bottom contains a USB-C connector,…
I decided to add place for bothy CAN-FD and RS485 as IPC on the module. The design seen from left is CAN at top, RS485 on bottom – switching the module to right we get the oposite. I have the extra space to do it and it allows me to build modules using UART’s only.…